background image

DATA  SHEET

Product specification

File under Integrated Circuits, IC02

October 1992

INTEGRATED CIRCUITS

TSA5512

1.3 GHz Bidirectional I

2

C-bus

controlled synthesizer

background image

October 1992

2

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

FEATURES

Complete 1.3 GHz single chip system

Low power 5 V, 35 mA

I

2

C-bus programming

In-lock flag

Varicap drive disable

Low radiation

Address selection for Picture-In-Picture (PIP), DBS

tuner (3 addresses)

Analog-to-digital converter

8 bus controlled ports (6 for TSA5512T), 8 open

collector outputs (4 bidirectional)

Power-down flag

APPLICATIONS

TV tuners

VCR Tuners

DESCRIPTION

The TSA5512 is a single chip PLL frequency synthesizer

designed for TV tuning systems. Control data is entered

via the I

2

C-bus; five serial bytes are required to address

the device, select the oscillator frequency, programme the

eight output ports and set the charge-pump current. Four

of these ports can also be used as input ports (three

general purpose I/O ports, one ADC). Digital information

concerning those ports can be read out of the TSA5512 on

the SDA line (one status byte) during a READ operation. A

flag is set when the loop is “in-lock” and is read during a

READ operation. The device has one fixed I

2

C-bus

address and 3 programmable addresses, programmed by

applying a specific voltage on Port 3. The phase

comparator operates at 7.8125 kHz when a 4 MHz crystal

is used.

ORDERING INFORMATION

Note

1. SOT102-1; 1996 December 5.

2. SOT109-1; 1996 December 5.

3. SOT163-1; 1996 December 5.

4. SOT266-1; 1996 December 5.

EXTENDED TYPE

NUMBER

PACKAGE

PINS

PIN POSITION

MATERIAL

CODE

TSA5512

18

DIL

plastic

SOT102

(1)

TSA5512T

16

SO

plastic

SOT109A

(2)

TSA5512AT

20

SO

plastic

SOT163A

(3)

TSA5512M

20

SSOP

plastic

SOT266

(4)

background image

October 1992

3

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

QUICK REFERENCE DATA

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

V

CC

supply voltage

5

V

I

CC

supply current

35

mA

fr

frequency range

64

1300

MHz

V

I

input voltage level

80 MHz to 150 MHz

12

300

mV

150 MHz to 1 GHz

9

300

mV

1 GHz to 1.3 GHz

40

300

mV

f

XTAL

crystal oscillator frequency

3.2

4.0

4.48

MHz

I

O

open-collector output current

5

mA

T

amb

operating ambient temperature range

10

+80

°

C

T

stg

IC storage temperature range

40

+150

°

C

background image

October 1992

4

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled

synthesizer

TSA5512

Fig.1  Block diagram.

background image

October 1992

5

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

Fig.2  Pin configuration for SOT102.

Fig.3  Pin configuration for SOT109.

Fig.4  Pin configuration for SOT163/SOT266.

background image

October 1992

6

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

PINNING

FUNCTIONAL DESCRIPTION

The TSA5512 is controlled via the two-wire I

2

C-bus. For programming, there is one module address (7 bits) and the R/W

bit for selecting READ or WRITE mode.

WRITE mode: R/W = 0 (see Table 1)

After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully

program the TSA5512. The bus transceiver has an auto-increment facility which permits the programming of the

TSA5512 within one single transmission (address + 4 data bytes).

The TSA5512 can also be partially programmed on the condition that the first data byte following the address is byte 2

or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted

indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an

I

2

C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the

device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high

impedance state.

The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512.

Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes

of 50 kHz.

SYMBOL

PIN

DESCRIPTION

SOT102

SOT109

SOT163

SOT266

PD

1

1

1

charge-pump output

Q1

2

2

2

crystal oscillator input 1

Q2

3

3

3

crystal oscillator reference voltage

n.c.

4

not connected

SDA

4

4

5

serial data input/output

SCL

5

5

6

serial clock input

P7

6

6

7

port output/input (general purpose)

n.c.

8

not connected

P6

7

7

9

port output/input for general purpose ADC

P5

8

8

10

port output/input (general purpose)

P4

9

9

11

port output/input (general purpose)

P3

10

10

12

port output/input for address selection

P2

11

11

13

port output

P1

12

14

port output

P0

13

15

port output

V

CC

14

12

16

voltage supply

RF

IN1

15

13

17

UHF/VHF signal input 1

RF

IN2

16

14

18

UHF/VHF signal input 2 (decoupled)

V

EE

17

15

19

ground

UD

18

16

20

drive output

background image

October 1992

7

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

Table 1

Write data format

Note to Table 1

MSB

LSB

Address

1

1

0

0

0

MA1

MA0

0

A

byte 1

Programmable

divider

0

N14

N13

N12

N11

N10

N9

N8

A

byte 2

Programmable

divider

N7

N6

N5

N4

N3

N2

N1

N0

A

byte 3

Charge-pump

and test bits

1

CP

T1

T0

1

1

1

OS

A

byte 4

Output ports

control bits

P7

P6

P5

P4

P3

P2

P1*

P0*

A

byte 5

*

not valid for TSA5512T

MA1,MAO

programmable address bits (see Table 4)

A

acknowledge bit

N14 to N0

programmable divider bits

N = N14

 ×

 2

14

+ N13

×

 2

13

 +... +N1

 ×

 2

1

+ NO

CP

charge-pump current

CP = 0

50

µ

A

CP = 1

220

µ

A

P7 to P0 = 1

open-collector output is active

P7 to P0 = 0

outputs are in high impedance state

T1, T0, OS = 0 0 0

normal operation

T1 = 1

P6 = f

ref

, P7 = f

DIV

T0 = 1

3-state charge-pump

OS = 1

operational amplifier output is switched off (varicap drive disable)

background image

October 1992

8

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

READ mode: R/W = 1 (see Table 2)

Data can be read out of the TSA5512 by setting the R/W bit to 1. After the slave address has been recognized, the

TSA5512 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first).

Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the

TSA5512 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge

from the processor occurs. The TSA5512 will then release the data line to allow the processor to generate a STOP

condition. When ports P3 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR

flag (power-on reset) is set to 1 when V

CC

 goes below 3 V and at power-on. It is reset when an end of data is detected

by the TSA5512 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates

(FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4

respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available

on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television

as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage

on port P6 is given in Table 3.

Table 2

Read data format

Note to Table 2

MSB is transmitted first

Address selection

The module address contains programmable address bits (MA1 and MA0) which together with the I/O port P3 offers the

possibility of having several synthesizers (up to 3) in one system.

The relationship between MA1 and MA0 and the input voltage I/O port P3 is given in Table 4

MSB

LSB

Address

1

1

0

0

0

MA1

MA0

1

A

byte 1

Status byte

POR

FL

I2

I1

I0

A2

A1

A0

byte 2

POR

power-on reset flag. (POR = 1 on power-on)

FL

in-lock flag (FL = 1 when the loop is phase-locked)

I2, I1, I0

digital information for I/O ports P7, P5 and P4 respectively

A2, A1 A0

digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3)

background image

October 1992

9

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

Table 3

ADC levels

Table 4

Address selection

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version

THERMAL RESISTANCE

VOLTAGE APPLIED ON THE PORT P6

A2

A1

A0

0.6 V

CC

 to 13.5 V

1

0

0

0.45 V

CC

 to 0.6 V

CC

0

1

1

0.3 V

CC

 to 0.45 V

CC

0

1

0

0.15 V

CC

 to 0.3 V

CC

0

0

1

0 to 0.15 V

CC

0

0

0

MA1

MA0

VOLTAGE APPLIED ON PORT P3

0

0

0 to 0.1 V

CC

0

1

always valid

1

0

0.4 to 0.6 V

CC

1

1

0.9 V

CC

 to 13.5 V

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

V

CC

supply voltage

0.3

6

V

V

1

charge-pump output voltage

0.3

V

CC

V

V

2

crystal (Q1) input voltage

0.3

V

CC

V

V

4

serial data input/output voltage

0.3

6

V

V

5

serial clock input voltage

0.3

6

V

V

6-13

P7 to P0 input/output voltage

0.3

+16

V

V

15

prescaler input voltage

0.3

V

CC

V

V

18

drive output voltage

0.3

V

CC

V

I

6-13

P7 to P0 output current (open collector)

1

15

mA

I

4

SDA output current (open collector)

1

5

mA

T

stg

IC storage temperature range

40

+150

°

C

T

j

maximum junction temperature

150

°

C

SYMBOL

PARAMETER

THERMAL RESISTANCE

R

th j-a

from junction to ambient in free air

DIL18

80 K/W

SO16

110 K/W

SO20

80 K/W

SSOP20

120 K/W

background image

October 1992

10

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

CHARACTERISTICS

V

CC

  =  5 V; T

amb

 = 25

°

C, unless otherwise specified

All pin numbers refer to DIL18 version

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Functional range

V

CC

supply voltage range

4.5

5.5

V

T

amb

operating ambient

temperature range

10

+80

°

C

f

input frequency

64

1300

MHz

N

divider

256

32767

I

CC

supply current

25

35

50

mA

f

XTAL

crystal oscillator

frequency range

crystal series resonance

resistance

150

3.2

4.0

4.48

MHz

Z

I

input impedance (pin 2)

480

400

320

input level

V

CC

 = 4.5 V to 5.5 V;

T

amb

 =

10 to +80

°

C;

see typical sensitivity curve

Fig.6

f = 80 to 150 MHz

12/

25

300/2.6

mV/dBm

f = 150 to 1000 MHz

9/

28

300/2.6

mV/dBm

f = 1000 to 1300 MHz

40/

15

300/2.6

mV/dBm

R

I

prescaler input resistance

(see Fig.7)

50

C

I

input capacitance

2

pF

Output ports (open collector) P0 to P7 (see note 1)

I

LO

output leakage current

V

O

 = 13.5 V

10

µ

A

V

OL

LOW level output voltage

I

OL

 = 5 mA; note 2

0.7

V

Input port P3

I

OH

HIGH level input current

V

OH

 = 13.5 V

10

µ

A

I

OL

LOW level input current

V

OL

 = 0 V

10

µ

A

Input ports P4, P5 and P7

V

IL

LOW level input voltage

0.8

V

V

IH

HIGH level input voltage

2.7

V

I

IH

HIGH level input current

V

IH

 = 13.5 V

10

µ

A

I

IL

LOW level input current

V

IL

 = 0 V

10

µ

A

Input port P6

I

IH

HIGH level input current

V

IH

 = 13.5 V

10

µ

A

I

IL

LOW level input current

V

IL

 = 0 V

10

µ

A

SCL and SDA inputs

V

IH

HIGH level input voltage

3.0

5.5

V

V

IL

LOW level input voltage

1.5

V

background image

October 1992

11

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

Notes to the characteristics

1. When a port is active, the collector voltage must not exceed 6 V.

2. Measured with all open-collector ports active.

SCL and SDA inputs

I

IH

HIGH level input current

V

IH

 = 5 V; V

CC

 = 0 V

10

µ

A

V

IH

 = 5 V; V

CC

 = 5 V

10

µ

A

I

IL

LOW level input current

V

IL

  =  0 V; V

CC

 = 0 V

10

µ

A

V

IL

  =  0 V; V

CC

 = 5 V

10

µ

A

Output SDA (pin 4; open collector)

I

LO

output leakage current

V

O

 = 5.5 V

10

µ

A

V

O

output voltage

I

O

 = 3 mA

0.4

V

Charge-pump output PD (pin 1)

I

OH

HIGH level output current

(absolute value)

CP = 1

90

220

300

µ

A

I

OL

LOW level output current

(absolute value)

CP = 0

22

50

75

µ

A

V

1

output voltage

in-lock

1.5

2.5

V

I

1leak

off-state leakage current

T0 = 1

5

5

nA

Operational amplifier output UD (test mode T0 = 1)

V

18

output voltage

V

IL

 = 0 V

100

mV

V

18

output voltage when

switched-off

OS = 1; V

IL

 = 2 V

200

mV

G

operational amplifier

current gain;

I

18

/(I

1

 - I

1leak

)

OS = 0; V

IL

 = 2 V;

I

18

 = 10

µ

A

2000

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

background image

October 1992

12

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled

synthesizer

TSA5512

Fig.5  Typical application (DIL18).

background image

October 1992

13

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

Fig.6  Prescaler typical input sensitivity curve; V

CC

= 4.5 to 5.5 V; T

amb

=

10 to +80

°

C.

Fig.7  Prescaler Smith chart of typical input impedance; V

CC

= 5 V; reference value = 50

.

background image

October 1992

14

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

FLOCK FLAG DEFINITION (FL)

When the FL flag is 1, the maximum frequency deviation (

f) from stable frequency can be expressed as follows:

Where:

FLOCK FLAG APPLICATION

K

VCO

 = 16 MHz/V (UHF band)

I

CP

 = 220 mA

C1 = 180 nF

C2 = 39 nF

• ∆

f =

±

27.5 kHz.

Table 5

Flock flag settings

K

VCO

=

oscillator slope (Hz/V)

I

CP

=

charge-pump current (A)

K

O

=

4

×

10E6

C1 and C2

=

loop filter capacitors (see Fig.8)

MIN.

MAX.

UNIT

Time span between actual phase lock and FL-flag setting

1024

1152

µ

s

Time span between the loop losing lock and FL-flag resetting

0

128

µ

s

f

K

VCO

K

O

(

)

±

I

CP

C1

C2

+

(

)

C1

C2

×

(

)

×

×

=

Fig.8  Loop filter.

background image

October 1992

15

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

PACKAGE OUTLINE

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

SOT102-1

93-10-14

95-01-23

UNIT

A

max.

1

2

b

1

(1)

(1)

(1)

b

2

c

D

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A  

min.

A  

max.

b

max.

w

M

E

e

1

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

0.254

2.54

7.62

8.25

7.80

9.5

8.3

0.85

4.7

0.51

3.7

inches

0.055

0.044

0.021

0.015

0.013

0.009

1.40

1.14

0.055

0.044

0.86

0.84

0.26

0.24

0.15

0.13

0.01

0.10

0.30

0.32

0.31

0.37

0.33

0.033

0.19

0.020

0.15

M

H

c

(e  )

1

M

E

A

L

seating plane

A

1

w

M

b

1

b

2

e

D

A

2

Z

18

1

10

9

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 

DIP18: plastic dual in-line package; 18 leads (300 mil)

SOT102-1

background image

October 1992

16

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

X

w

M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v

M

A

(A  )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 

1.0

0.4

 SOT109-1

95-01-23

97-05-22

 076E07S

 MS-012AC

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.020

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

0

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

background image

October 1992

17

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

UNIT

A

max.

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  

1.1

0.4

 SOT163-1

10

20

w

M

b

p

detail X

Z

e

11

1

D

y

0.25

 075E04

 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0

5

10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v

M

A

(A  )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24

97-05-22

background image

October 1992

18

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

UNIT

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

0.15

0

1.4

1.2

0.32

0.20

0.20

0.13

6.6

6.4

4.5

4.3

0.65

1.0

0.2

6.6

6.2

0.65

0.45

0.48

0.18

10

0

o

o

0.13

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. 

0.75

0.45

 SOT266-1

90-04-05

95-02-25

w

M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v

M

A

X

(A  )

3

A

y

0.25

1

10

20

11

pin 1 index

0

2.5

5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

A

max.

1.5

background image

October 1992

19

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled

synthesizer

TSA5512

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook” (order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260

°

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300

°

C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400

°

C, contact may be up to 5 seconds.

SO and SSOP

R

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO and

SSOP packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250

°

C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45

°

C.

W

AVE SOLDERING

Wave soldering is not recommended for SSOP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following

conditions must be observed:

A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate

solder thieves at the downstream end.

Even with these conditions, only consider wave

soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or

SSOP20 (SOT266-1).

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260

°

C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150

°

C within

6 seconds. Typical dwell time is 4 seconds at 250

°

C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300

°

C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320

°

C.

background image

October 1992

20

Philips Semiconductors

Product specification

1.3 GHz Bidirectional I

2

C-bus controlled synthesizer

TSA5512

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

2

C components conveys a license under the Philips’ I

2

C patent to use the

components in the I

2

C system provided the system conforms to the I

2

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.