background image

DATA  SHEET

Product specification

File under Integrated Circuits, IC02

April 1995

INTEGRATED CIRCUITS

SAA1310

Control interface for VHS video

recorders

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April 1995

2

Philips Semiconductors

Product specification

Control interface for VHS video

recorders

SAA1310

FEATURES

Full support of VISS and VASS mode (VHS

Index/Address Search System)

Read, write and overwrite of Tape Control/head signal

(CTL)

Power-ON and power-failure indicator

4 general purpose comparators for interface between

sensors and microprocessor

2 comparators have a 100 mA output driver

PAL and NTSC compatible

GENERAL DESCRIPTION

The SAA1310 provides an interface between the tape

control head in the VHS deck-electronics.

The circuit also includes an interface between sensors in

the deck mechanics and the microprocessor.

ORDERING INFORMATION

Note

1. SOT102-1; 1996 December 02.

2. SOT163-1; 1996 December 02.

EXTENDED

TYPE NUMBER

PACKAGE

PINS

PIN POSITION

MATERIAL

CODE

SAA1310

18

DIL

plastic

SOT102

(1)

SAA1310T

20

SO

plastic

SOT163A

(2)

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April 1995

3

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

Pin numbers in parenthesis refer to the SAA1310T.

Fig.1  Block diagram.

handbook, full pagewidth

comparator 1

comparator 2

comparator 3

comparator 4

SAA1310

(SAA1310T)

Vref

POWER-ON AND

POWER-FAILURE

DETECTOR

AMPLIFIER

FILTER

DETECTOR

WRITE

AMPLIFIER

Vref

write 

current

VP

GND

VP

comparator 1

non - inverting input

comparator 1

output

comparator 2

non - inverting input

comparator 2

output

comparator 3

inverting input

comparator 3

output

comparator 4

inverting input

comparator 4

output

power on/failure

output

power on/failure

capacitor

write/read

input

control head data

output

reference voltage

output

control head

input/output

control head

feedback

1

(1)

4

(4)

18

(20)

17

(19)

16

(18)

15

(17)

14

(15)

13

(14)

11

(12)

10

(11)

2

(2)

3

(3)

5

(6)

6

(7)

7

(8)

12  (13)

8

(9)

9  (10)

capstan reverse

input

MEA082 - 1

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April 1995

4

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

PIN CONFIGURATION

 PINNING (pins in parenthesis refer to SAA1310T)

SYMBOL

PIN

DESCRIPTION

CTL FB

1

(1)

control head feedback

CTL I/O

2

(2)

control head input/output

V

ref

3

(3)

reference voltage output

CPO/FAIL

4

(4)

power on/failure capacitor

CIN1

5

(6)

comparator 1 input

CIN2

6

(7)

comparator 2 input

CIN3

7

(8)

comparator 3 input

CIN4

8

(9)

comparator 4 input

V

P

9

(10)

supply voltage

WRITE/READ

10

(11)

write/read input

COUT4

11

(12)

comparator 4 output

GND

12

(13)

ground

COUT3

13

(14)

comparator 3 output

COUT2

14

(15)

comparator 2 output

COUT1

15

(17)

comparator 1 input

CTL DATA

16

(18)

control head data output

PO/FAIL OUT

17

(19)

power on/failure output

CAPREV

18

(20)

capstan reverse input

dbook, halfpage

MEA083

1

2

3

4

5

6

7

8

9

18

17

16

15

14

13

12

11

10

CAPREV

PO/FAIL OUT

CTL DATA

COUT1  

GND

COUT2  

COUT3 

COUT4  

CTL FB

CTL I/O

Vref

CPO/FAIL

VP

CIN1

CIN2

CIN3

CIN4

SAA1310

WRITE/READ

handbook, halfpage

MEA084

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

CAPREV

PO/FAIL OUT

CTL DATA

COUT1  

CTL FB

CTL I/O

Vref

CPO/FAIL

SAA1310T

VP

CIN1

CIN2

CIN3

CIN4

GND

COUT2  

COUT3 

COUT4  

WRITE/READ

n.c.

n.c.

Fig.2  Pin configurations.

a.  SAA1310.

b.  SAA1310T.

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April 1995

5

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

LIMITING VALUES (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)

In accordance with the Absolute Maximum System (IEC 134)

THERMAL RESISTANCE

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

V

P

supply voltage range

0

6.0

V

V

I

/V

O

voltage on all pins

except pins 11 (12) and 13 (14)

0

V

P

V

V

O

output voltage on pins 11 (12) and 13 (14)

0

18

V

T

stg

storage temperature range

65

+

150

°

C

T

amb

ambient temperature range

0

+

70

°

C

SYMBOL

PARAMETER

TYP.

MAX.

UNIT

R

th

thermal resistance (SAA1310)

75

K/W

R

th

thermal resistance (SAA1310T)

90

K/W

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April 1995

6

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

CHARACTERISTICS (PIN NUMBERS IN PARENTHESIS REFER TO SAA1310T)

V

P

= 5 V; T

amb

= 25

°

C; all voltage referenced to pin 12 (13); according to the test set-up (see Fig.4); unless otherwise

specified

SYMBOL

PARAMETER

CONDITION

MIN.

TYP.

MAX.

UNIT

P

d

power dissipation

note 1

85

mW

Supply pin 9 (10)

V

P

supply voltage

4.5

5.0

5.5

V

I

P

supply current

read mode

10

15

20

mA

write mode; duty factor = 50%

13

18

24

mA

CTL I/O pin 2 (2)

READ MODE PIN 10 (11)

<

0.5 V

V

I

input voltage (peak-to-

f = 500 Hz

0.35

mV

peak value)

f = 30 kHz; non-linear operation

200

mV

B

bandwidth low-pass filter

3

kHz

I

b

input bias current

read mode

0.1

µ

A

WRITE MODE PIN 10 (11)

>

3.5 V

V

O

output voltage LOW

I

CTL I/O

= 3 mA;

0.4

V

pin CTL DATA = HIGH

V

O

output voltage HIGH

I

CTL I/O

=

3 mA;

4.6

V

pin CTL DATA = LOW

WRITE/READ pin 10 (11)

V

I

input voltage

read mode

0.5

V

write mode; analog

1.6

3.3

V

I

I

input current

read mode

1.5

µ

A

write mode

0.1

µ

A

V

ref

 pin 3 (3); note 2

V

O

output voltage

2.4

2.5

2.6

V

I

tot

total current

including write current

4

+

4

mA

R

O

output resistance

0.4

0.6

CAPREV pin 18 (20)

V

IH

input voltage HIGH

2.0

V

V

IL

input voltage LOW

0.8

V

I

IH

input current HIGH

V

CAPREV

= 5 V

10

µ

A

I

IH

input current LOW

V

CAPREV

= 0 V

10

µ

A

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April 1995

7

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

CTL DATA pin 16 (18)

WRITE MODE

V

IH

input voltage HIGH

2.0

V

V

IL

input voltage LOW

0.8

V

I

IH

input current HIGH

V

CTL DATA

= 5 V

10

µ

A

I

IL

input current LOW

V

CTL DATA

= 0 V

10

µ

A

READ MODE

V

OL

output voltage LOW

I

OL

= 0.5 mA

0.4

V

V

OH

output voltage HIGH

I

OH

=

50

µ

A

2.4

V

CPO/FAIL and PO/FAIL OUT pin 4 (4) and 17 (19); see Fig.3

V

O

operating voltage range

at decreasing V

P

1.5

5.5

V

V

OL

output voltage LOW

I

OL

= 1 mA

0.4

V

V

OH

output voltage HIGH

I

OH

= 1 mA

V

P

0.9

V

t

d

delay time

C

CAPREV

= 68 nF

50

ms

V

TL1

threshold level 1

4.5

4.8

V

V

TL2

threshold level 2

3.5

V

I

O

source current pin 4

3

µ

A

I

O

sink current pin 4

300

µ

A

V

O(min.)

minimum output voltage

20

mV

V

O(max.)

maximum output voltage

2.1

V

High output current type comparators

CIN3 and CIN4 pins 7 (8) and 8 (9)

V

hys

input hysteresis

10

mV

V

IL

input voltage LOW

V

ref

10 mV

V

V

IH

input voltage HIGH

V

ref

+

10 mV

V

I

IL

input current LOW

CIN3 = CIN4 = 0 V

1

µ

A

I

IH

input current HIGH

CIN3 = CIN4 = V

P

+

1

µ

A

COUT3 and COUT4 pins 13 (14) and 11 (12)

V

OL

output voltage LOW

I

OL

= 100 mA

1.0

V

I

OL

= 2 mA

0.4

V

±

I

OL

leakage current

output voltage HIGH;

COUT3 = COUT4 = 17 V

1

µ

A

t

tr

transient time

note 3

0.5

µ

s

T

j

thermal protection

130

°

C

SYMBOL

PARAMETER

CONDITION

MIN.

TYP.

MAX.

UNIT

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April 1995

8

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

Notes to the characteristics

1. Without the sink current of the comparators; in write mode.

2. Minimum value of capacitor connected to this pin is 4.7

µ

F.

3. V

i

= 100 mV p-p. Inputs connected to V

ref

 via a 10 k

resistor; outputs connected to V

P

via a 250

resistor.

4. V

i

= 100 mV p-p. Inputs connected to V

ref

via a 10 k

resistor; outputs connected to V

P

via a 2.5 k

resistor.

Low output current type comparators

CIN1 AND CIN2 pins 5 (6) and 6 (7)

V

hys

input hysteresis

10

mV

V

IL

input voltage LOW

V

ref

10 mV

V

V

IH

input voltage HIGH

V

ref

+

10 mV

V

I

I

input current

CIN1 = CIN2 = 0 V

1

µ

A

CIN1 = CIN2 = V

P

+1

µ

A

COUT1 AND COUT2 pins 15 (17) and 14 (15)

V

OL

output voltage HIGH

I

OH

=

100

µ

A

4.5

V

V

OH

output voltage LOW

I

OL

= 2 mA

1

V

t

tr

transient time

note 4

0.5

µ

s

SYMBOL

PARAMETER

CONDITION

MIN.

TYP.

MAX.

UNIT

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April 1995

9

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

MEA085

100

100

td

td

td

td

td

t

VP

V17 (19)

t

VTL1

VTL2

1.5 V

Fig.3  Power-ON and power-failure detector.

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April 1995

10

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

APPLICATION INFORAMTION

Fig.4  Test circuit diagram.

Pin numbers in parenthesis refer to the SAA1310T.

handbook, full pagewidth

MEA086 - 1

13

(14)

AMPLIFIER

FIL

TER

DETECT

OR

1

(1)

2

(2)

V

P

compar

ator 1

compar

ator 2

compar

ator 3

compar

ator 4

SAA1310

(SAA1310T)

WRITE

AMPLIFIER

wr

ite 

current

GND

4

(4)

18

(20)

16

(18)

15

(17)

14

(15)

11

(12)

10

(11)

3

(3)

5

(6)

6

(7)

7

(8)

12(13)

8

(9)

9(10)

V

ref

PO

WER-ON AND

PO

WER-F

AILURE

DETECT

OR

V

P

17

(19)

+

+

+

+

+

IV

IV

IV

IV

V

I

V

I

I

82 nF

10 

µ

F

650 

V

i

I

R

W

I

V

I

V

I

V

I

V

I

I

V

ref

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April 1995

11

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

handbook, full pagewidth

47 

µ

F

4.7 nF

68

nF

47 

µ

F

100

nF

47 k

+5 V

SAA1310

(SAA1310T)

1

(1)

2

(2)

3

(3)

4

(4)

5

(6)

6

(7)

7

(8)

18

(20)

17

(19)

16

(18)

15

(17)

14

(15)

13

(14)

12

(13)

VI

CTL head

47 

µ

F

8

(9)

11

(12)

10

(11)

9

(10)

VI

VI

VI

VI

COUT4

COUT1

COUT2

COUT3

CAPREV

PO/FAIL OUT

CTL DATA

WRITE/READ

MEA087

Pin numbers in parenthesis refer to the SAA1310T.

Fig.5  Application diagram.

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April 1995

12

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

PACKAGE OUTLINES

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

SOT102-1

93-10-14

95-01-23

UNIT

A

max.

1

2

b

1

(1)

(1)

(1)

b

2

c

D

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A  

min.

A  

max.

b

max.

w

M

E

e

1

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

0.254

2.54

7.62

8.25

7.80

9.5

8.3

0.85

4.7

0.51

3.7

inches

0.055

0.044

0.021

0.015

0.013

0.009

1.40

1.14

0.055

0.044

0.86

0.84

0.26

0.24

0.15

0.13

0.01

0.10

0.30

0.32

0.31

0.37

0.33

0.033

0.19

0.020

0.15

M

H

c

(e  )

1

M

E

A

L

seating plane

A

1

w

M

b

1

b

2

e

D

A

2

Z

18

1

10

9

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 

DIP18: plastic dual in-line package; 18 leads (300 mil)

SOT102-1

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April 1995

13

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

UNIT

A

max.

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

inches

2.65

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  

1.1

0.4

 SOT163-1

10

20

w

M

b

p

detail X

Z

e

11

1

D

y

0.25

 075E04

 MS-013AC

pin 1 index

0.10

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.050

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0

5

10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v

M

A

(A  )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24

97-05-22

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April 1995

14

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook” (order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260

°

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300

°

C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400

°

C, contact may be up to 5 seconds.

SO

R

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250

°

C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45

°

C.

W

AVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

The longitudinal axis of the package footprint must be

parallel to the solder flow.

The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260

°

C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150

°

C within

6 seconds. Typical dwell time is 4 seconds at 250

°

C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300

°

C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320

°

C.

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April 1995

15

Philips Semiconductors

Product specification

Control interface for VHS video recorders

SAA1310

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.