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1

POST OFFICE BOX 655303 

 DALLAS, TEXAS 75265

Copyright 

©

 1999, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

The CD54/74AC540, -541, and CD54/74ACT540, -541 octal

buffer/line drivers use the RCA ADVANCED CMOS technology. The

CD54/74AC/ACT540 are inverting 3-state buffers having two

active-LOW output enables. The CD54/74AC/ACT541 are

non-inverting 3-state buffers having two active-LOW output enables.

The CD74AC540, -541, and CD74ACT540, -541 are supplied in

20-lead dual-in-line plastic packages (E suffix) and in 20-lead

dual-in-line small-outline plastic packages (M suffix). Both package

types are operable over the following temperature ranges: Industrial

(–40 to +85

°

C) and Extended Industrial/Military (–55 to +125

°

C).

The CD54AC540, -541, and CD54ACT540, -541, available in chip

form (H suffix), are operable over the –55 to +125

°

C temperature

range.

L

H

Z

Data sheet acquired from Harris Semiconductor

SCHS285A – Revised November 1999

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POST OFFICE BOX 655303 

 DALLAS, TEXAS 75265

MAXIMUM RATINGS, 

Absolute-Maximum Values:

DC SUPPLY-VOLTAGE (VCC)

–0.5 to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

DC INPUT DIODE CURRENT, IIK (for VI < –0.5 or VI > VCC + 0.5 V)

±

20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

DC OUTPUT DIODE CURRENT, IOK (for VO < –0.5 or VO > VCC + 0.5 V)

±

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

DC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > –0.5 or VO < VCC + 0.5 V)

±

50 mA

. . . . . . . . . . . . . . . . . . . . . . . 

DC VCC OR GROUND CURRENT (ICC or IGND)

±

100 mA*

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

PACKAGE THERMAL IMPEDANCE, 

θ

JA (see Note 1): E package

69

°

C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

M package

58

°

C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

STORAGE TEMPERATURE (Tstg)

–65 to +150

°

C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

LEAD TEMPERATURE (DURING SOLDERING):

At distance 1/16 

±

 1/32 in. (1.59 

±

 0.79 mm) from case for 10 s maximum

+265

°

C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 

Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only

+300

°

C

. . . . . . . . . . . . . . . . . . . . . . . . 

* For up to 4 outputs per device: add 

±

25 mA for each additional output.

NOTE 1:

The package thermal impedance is calculated in accordance with JESD 51.

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POST OFFICE BOX 655303 

 DALLAS, TEXAS 75265

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POST OFFICE BOX 655303 

 DALLAS, TEXAS 75265

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POST OFFICE BOX 655303 

 DALLAS, TEXAS 75265

ns

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POST OFFICE BOX 655303 

 DALLAS, TEXAS 75265

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IMPORTANT NOTICE

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue

any product or service without notice, and advise customers to obtain the latest version of relevant information

to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily

performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF

DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR

WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER

CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO

BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent

that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other

intellectual property right of TI covering or relating to any combination, machine, or process in which such

semiconductor products or services might be or are used. TI’s publication of information regarding any third

party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Copyright 

©

 1999, Texas Instruments Incorporated