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16-Bit Transceivers

CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

SCCS026 - July 1994 - Revised March 2000

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modified to remove devices not offered.

Copyright

 ©

 2000, Texas Instruments Incorporated

1CY74FCT16445T/2

H245T

Features

• FCT-E speed at 3.2 ns

• Power-off disable outputs permits live insertion

• Edge-rate control circuitry for significantly improved

noise characteristics

• Typical output skew < 250 ps

• ESD > 2000V

• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)

packages

• Industrial temperature range of –40˚C to +85˚C

• V

CC

 = 5V

±

 10%

CY74FCT16245T Features:

• 64 mA sink current, 32 mA source current

• Typical V

OLP

 (ground bounce)<1.0V at V

CC

 = 5V,

T

A

 = 25˚C

CY74FCT162245T Features:

• Balanced output drivers: 24 mA

• Reduced system switching noise

• Typical V

OLP

 (ground bounce) <0.6V at V

CC

 = 5V,

T

A

= 25˚C

CY74FCT162H245T Features:

• Bus hold on data inputs

• Eliminates the need for external pull-up or pull-down

resistors

Functional Description

These 16-bit transceivers are designed for use in bidirectional

synchronous communication between two buses, where high

speed and low power are required. With the exception of the

CY74FCT16245T, these devices can be operated either as

two independent octals or a single 16-bit transceiver. Direction

of data flow is controlled by (DIR), the Output Enable (OE)

transfers data when LOW and isolates the buses when HIGH.

The output buffers are designed with power off disable capa-

bility to allow for live insertion of boards.

The

CY74FCT16245T

is

ideally

suited

for

driving

high-capacitance loads and low-impedance backplanes.

The CY74FCT162245T has 24-mA balanced output drivers

with current limiting resistors in the outputs. This reduces the

need for external terminating resistors and provides for mini-

mal

undershoot

and

reduced

ground

bounce.

The

CY74FCT162245T is ideal for driving transmission lines.

The CY74FCT162H245T is a 24-mA balanced output part that

has bus hold on the data inputs. The device retains the input’s

last state whenever the input goes to high impedance. This

eliminates the need for pull-up/down resistors and prevents

floating inputs.

GND

Logic Block Diagrams CY74FCT16245T,CY74FCT162245T,

CY74FCT162H245T

Pin Configuration

1

2

3

4

5

6

7

8

9

10

11

12

33

32

31

30

29

25

26

27

28

36

35

1

DIR

34

SSOP/TSSOP

Top View

13

14

15

16

17

18

19

20

21

22

23

24

45

44

43

42

41

37

38

39

40

48

47

46

1

B

1

1

B

2

1

B

3

1

B

4

1

A

1

1

A

2

1

A

3

1

A

4

1

OE

GND

GND

V

CC

1

B

7

1

B

8

1

B

5

1

B

6

1

A

5

1

A

6

1

A

7

1

A

8

V

CC

GND

GND

2

B

3

2

B

4

2

B

1

2

B

2

2

A

1

2

A

2

2

A

3

2

A

4

GND

GND

V

CC

2

B

7

2

B

8

2

B

5

2

B

6

2

A

5

2

A

6

2

A

7

2

A

8

V

CC

GND

2

DIR

2

OE

FCT16245–1

1

A

1

1

A

2

1

A

3

1

A

4

1

A

5

1

A

6

1

A

7

1

OE

1

B

1

1

B

2

1

B

3

1

B

4

1

B

5

1

B

6

1

B

7

1

DIR

1

A

8

1

B

8

FCT16245–2

2

A

1

2

A

2

2

A

3

2

A

4

2

A

5

2

A

6

2

A

7

2

OE

2

B

1

2

B

2

2

B

3

2

B

4

2

B

5

2

B

6

2

B

7

2

DIR

2

A

8

2

B

8

FCT16245–3

16245T

162245T

162H245T

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CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

2

Maximum Ratings

[3, 4]

(Above which the useful life may be impaired. For user

guidelines, not tested.)

Storage Temperature ........................Com’l -55

°

C to +125

°

C

Ambient Temperature with

Power Applied....................................Com’l -55

°

C to +125

°

C

DC Input Voltage ........................................... –0.5V to +7.0V

DC Output Voltage......................................... –0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin) ........................–60 to +120 mA

Power Dissipation .......................................................... 1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Notes:

1.

On CY74FCT162H245T these pins have bus hold.

2.

H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.

3.

Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.

4.

Unused inputs must always be connected to an appropriate logic voltage level, preferably either V

CC

 or ground.

Pin Description

Name

Description

OE

Three-State Output Enable Inputs (Active LOW)

DIR

Direction Control

A

Inputs or Three-State Outputs

[1]

B

Inputs or Three-State Outputs

[1]

Function Table

[2]

Inputs

Outputs

OE

DIR

L

L

Bus B Data to Bus A

L

H

Bus A Data to Bus B

H

X

High Z State

Operating Range

Range

Ambient

Temperature

V

CC

Industrial

–40

°

C to +85

°

C

5V

±

 10%

Electrical Characteristics

Over the Operating Range

Parameter

Description

Test Conditions

Min.

Typ.

[5]

Max.

Unit

V

IH

Input HIGH Voltage

2.0

V

V

IL

Input LOW Voltage

0.8

V

V

H

Input Hysteresis

[6]

100

mV

V

IK

Input Clamp Diode Voltage

V

CC

=Min., I

IN

=–18 mA

–0.7

–1.2

V

I

IH

Input HIGH Current

Standard

V

CC

=Max., V

I

=V

CC

±

1

µ

A

Bus Hold

±

100

I

IL

Input LOW Current

Standard

V

CC

=Max., V

I

=GND

±

1

µ

A

Bus Hold

±

100

µ

A

I

BBH

I

BBL

Bus Hold Sustain Current on Bus Hold Input

[7]

V

CC

=Min.

V

I

=2.0V

–50

µ

A

V

I

=0.8V

+50

I

BHHO

I

BHLO

Bus Hold Overdrive Current on Bus Hold Input

[7]

V

CC

=Max., V

I

=1.5V

TBD

mA

I

OZH

High Impedance Output Current

(Three-State Output pins)

V

CC

=Max., V

OUT

=2.7V

±

1

µ

A

I

OZL

High Impedance Output Current

(Three-State Output pins)

V

CC

=Max., V

OUT

=0.5V

±

1

µ

A

I

OS

Short Circuit Current

[8]

V

CC

=Max., V

OUT

=GND

–80

–140

–200

mA

I

O

Output Drive Current

[8]

V

CC

=Max., V

OUT

=2.5V

–50

–180

mA

I

OFF

Power-Off Disable

V

CC

=0V, V

OUT

4.5V

[9]

±

1

µ

A

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CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

3

Output Drive Characteristics for CY74FCT16245T

Parameter

Description

Test Conditions

Min.

Typ.

[5]

Max.

Unit

V

OH

Output HIGH Voltage

V

CC

=Min., I

OH

=–3 mA

2.5

3.5

V

V

CC

=Min., I

OH

=–15 mA

2.4

3.5

V

V

CC

=Min., I

OH

=–32 mA

2.0

3.0

V

V

OL

Output LOW Voltage

V

CC

=Min., I

OL

=64 mA

0.2

0.55

V

Output Drive Characteristics for CY74FCT162245T, CY74FCT162H245T

Parameter

Description

Test Conditions

Min.

Typ.

[5]

Max.

Unit

I

ODL

Output LOW Current

[8]

V

CC

=5V, V

IN

=V

IH

 or V

IL

, V

OUT

=1.5V

60

115

150

mA

I

ODH

Output HIGH Current

[8]

V

CC

=5V, V

IN

=V

IH

 or V

IL

, V

OUT

=1.5V

–60

–115

–150

mA

V

OH

Output HIGH Voltage

V

CC

=Min., I

OH

=–24 mA

2.4

3.3

V

V

OL

Output LOW Voltage

V

CC

=Min., I

OL

=24 mA

0.3

0.55

V

Notes:

5.

Typical values are at V

CC

=5.0V, T

A

=+25˚C ambient.

6.

This parameter is specified but not tested.

7.

Pins with bus hold are described in Pin Description.

8.

Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of

a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter

tests, I

OS

 tests should be performed last.

9.

Tested at +25˚C.

Capacitance

[6]

(T

A

 = +25˚C, f = 1.0 MHz)

Parameter

Description

Test Conditions

Typ.

[5]

Max.

Unit

C

IN

Input Capacitance

V

IN

 = 0V

4.5

6.0

pF

C

OUT

Output Capacitance

V

OUT

 = 0V

5.5

8.0

pF

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CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

4

Power Supply Characteristics

Parameter

Description

Test Conditions

Typ.

[5]

Max.

Unit

I

CC

Quiescent Power Supply Current V

CC

=Max.

V

IN

<0.2V,

V

IN

>V

CC

-0.2V

5

500

µ

A

I

CC

Quiescent Power Supply Current

(TTL inputs HIGH)

V

CC

=Max.

V

IN

=3.4V

[10]

0.5

1.5

mA

I

CCD

Dynamic Power Supply

Current

[11]

V

CC

=Max., One Input Toggling,

50% Duty Cycle, Outputs Open,

OE=DIR=GND

V

IN

=V

CC

 or

V

IN

=GND

60

100

µ

A/MHz

I

C

Total Power Supply Current

[12]

V

CC

=Max., f

1

=10 MHz,

50% Duty Cycle, Outputs Open,

One Bit Toggling,

OE=DIR=GND

V

IN

=V

CC

 or

V

IN

=GND

0.6

1.5

mA

V

IN

=3.4V or

V

IN

=GND

0.9

2.3

mA

V

CC

=Max., f

1

=2.5 MHz, 50%

Duty Cycle, Outputs Open,

Sixteen Bits Toggling,

OE=DIR=GND

V

IN

=V

CC

 or

V

IN

=GND

2.4

4.5

[13]

mA

V

IN

=3.4V or

V

IN

=GND

6.4

16.5

[13]

mA

Notes:

10. Per TTL driven input (V

IN

=3.4V); all other inputs at V

CC

 or GND.

11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

12. I

C

= I

QUIESCENT

 + I

INPUTS

+ I

DYNAMIC

I

C

= I

CC

+

I

CC

D

H

N

T

+I

CCD

(f

0

/2 + f

1

N

1

)

I

CC

= Quiescent Current with CMOS input levels

I

CC

= Power Supply Current for a TTL HIGH input (V

IN

=3.4V)

D

H

= Duty Cycle for TTL inputs HIGH

N

T

= Number of TTL inputs at D

H

I

CCD

= Dynamic Current caused by an input transition pair (HLH or LHL)

f

0

= Clock frequency for registered devices, otherwise zero

f

1

= Input signal frequency

N

1

= Number of inputs changing at f

1

All currents are in milliamps and all frequencies are in megahertz.

13. Values for these conditions are examples of the I

CC

 formula. These limits are specified but not tested.

background image

CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

5

]

Switching Characteristics

Over the Operating Range

[14]

Description

74FCT16245T

74FCT162245T

74FCT16245AT

74FCT162245AT

74FCT162H245AT

Fig.

No.

[15]

Parameter

Min.

Max.

Min.

Max.

Unit

t

PLH

t

PHL

Propagation Delay Data to Output

A to B, B to A

1.5

7.0

1.5

4.5

ns

1, 3

t

PZH

t

PZL

Output Enable Time

OE to A or B

1.5

9.5

1.5

6.2

ns

1, 7, 8

t

PHZ

t

PLZ

Output Disable Time

OE to A or B

1.5

7.5

1.5

5.0

ns

1, 7, 8

t

PZH

t

PZL

Output Enable Time

DIR to A or B

1.5

9.5

1.5

6.2

ns

1, 7, 8

t

PHZ

t

PLZ

Output Disable Time

DIR to A or B

1.5

7.5

1.5

5.0

ns

1, 7, 8

t

SK(O)

Output Skew

[16]

0.5

0.5

ns

Description

74FCT16245CT

74FCT162245CT

74FCT162H245CT

74FCT16245ET

74FCT162245ET

74FCT162H245ET

Fig.

No.

[15]

Parameter

Min.

Max.

Min.

Max.

Unit

t

PLH

t

PHL

Propagation Delay Data to Output

A to B, B to A

1.5

4.1

1.5

3.2

ns

1, 3

t

PZH

t

PZL

Output Enable Time

OE to A or B

1.5

5.8

1.5

4.4

ns

1, 7, 8

t

PHZ

t

PLZ

Output Disable Time

OE to A or B

1.5

4.8

1.5

4.0

ns

1, 7, 8

t

PZH

t

PZL

Output Enable Time

DIR to A or B

1.5

5.8

1.5

4.8

ns

1, 7, 8

t

PHZ

t

PLZ

Output Disable Time

DIR to A or B

1.5

4.8

1.5

4.0

ns

1, 7, 8

t

SK(O)

Output Skew

[16]

0.5

0.5

ns

Note:

14. Minimum limits are specified but not tested on Propagation Delays.

15. See “Parameter Measurement Information” in the General Information section.

16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

Ordering Information CY74FCT16245

Speed

(ns)

Ordering Code

Package

Name

Package Type

Operating

Range

3.2

CY74FCT16245ETPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT16245ETPVC/PVCT

O48

48-Lead (300-Mil) SSOP

4.1

CY74FCT16245CTPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT16245CTPVC/PVCT

O48

48-Lead (300-Mil) SSOP

4.5

CY74FCT16245ATPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT16245ATPVC/PVCT

O48

48-Lead (300-Mil) SSOP

7.0

CY74FCT16245TPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT16245TPVC/PVCT

O48

48-Lead (300-Mil) SSOP

background image

CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

6

Ordering Information CY74FCT162245

Speed

(ns)

Ordering Code

Package

Name

Package Type

Operating

Range

3.2

74FCT162245ETPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162245ETPVC

O48

48-Lead (300-Mil) SSOP

74FCT162245ETPVCT

O48

48-Lead (300-Mil) SSOP

4.1

CY74FCT162245CTPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162245CTPVC

O48

48-Lead (300-Mil) SSOP

74FCT162245CTPVCT

O48

48-Lead (300-Mil) SSOP

4.5

74FCT162245ATPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162245ATPVC

O48

48-Lead (300-Mil) SSOP

74FCT162245ATPVCT

O48

48-Lead (300-Mil) SSOP

7.0

CY74FCT162245TPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162245TPVC/PVCT

O48

48-Lead (300-Mil) SSOP

Ordering Information CY74FCT162H245

Speed

(ns)

Ordering Code

Package

Name

Package Type

Operating

Range

3.2

74FCT162H245ETPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162H245ETPVC

O48

48-Lead (300-Mil) SSOP

74FCT162H245ETPVCT

O48

48-Lead (300-Mil) SSOP

4.1

74FCT162H245CTPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162H245CTPVC

O48

48-Lead (300-Mil) SSOP

74FCT162H245CTPVCT

O48

48-Lead (300-Mil) SSOP

4.5

74FCT162H245ATPACT

Z48

48-Lead (240-Mil) TSSOP

Industrial

CY74FCT162H245ATPVC

O48

48-Lead (300-Mil) SSOP

74FCT162H245ATPVCT

O48

48-Lead (300-Mil) SSOP

background image

 CY74FCT16245T/2245T

CY74FCT16445T/2H245T

7

Package Diagrams

48-Lead Shrunk Small Outline Package O48

background image

CY74FCT16245T

CY74FCT162245T

CY74FCT162H245T

8

Package Diagrams

48-Lead Thin Shrunk Small Outline Package Z48

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IMPORTANT NOTICE

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue

any product or service without notice, and advise customers to obtain the latest version of relevant information

to verify, before placing orders, that information being relied on is current and complete. All products are sold

subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those

pertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent

TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily

performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF

DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR

WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER

CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO

BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, adequate design and operating

safeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent

that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other

intellectual property right of TI covering or relating to any combination, machine, or process in which such

semiconductor products or services might be or are used. TI’s publication of information regarding any third

party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Copyright 

©

 2000, Texas Instruments Incorporated