background image

DATA  SHEET

Product specification

Supersedes data of September 1993

File under Integrated Circuits, IC06

1998 Jul 08

INTEGRATED CIRCUITS

74HC/HCT123

Dual retriggerable monostable

multivibrator with reset

For a complete data sheet, please also download:

The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications

The IC06 74HC/HCT/HCU/HCMOS Logic Package Information

The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

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1998 Jul 08

2

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

FEATURES

DC triggered from active HIGH or

active LOW inputs

Retriggerable for very long pulses

up to 100% duty factor

Direct reset terminates output

pulse

Schmitt-trigger action on all inputs

except for the reset input

Output capability: standard (except

for nR

EXT

/C

EXT

)

I

CC

 category: MSI

GENERAL DESCRIPTION

The 74HC/HCT123 are high-speed

Si-gate CMOS devices and are pin

compatible with low power Schottky

TTL (LSTTL). They are specified in

compliance with JEDEC standard no.

7A.

The 74HC/HCT123 are dual

retriggerable monostable

multivibrators with output pulse width

control by three methods. The basic

pulse time is programmed by

selection of an external resistor

(R

EXT

) and capacitor (C

EXT

). The

external resistor and capacitor are

normally connected as shown in

Fig.6.

Once triggered, the basic output

pulse width may be extended by

retriggering the gated active

LOW-going edge input (nA) or the

active HIGH-going edge input (nB).

By repeating this process, the output

pulse period (nQ = HIGH, nQ = LOW)

can be made as long as desired.

Alternatively an output delay can be

terminated at any time by a

LOW-going edge on input nR

D

, which

also inhibits the triggering.

An internal connection from nR

D

 to

the input gates makes it possible to

trigger the circuit by a positive-going

signal at input nR

D

 as shown in the

function table. Figures 7 and 8

illustrate pulse control by retriggering

and early reset. The basic output

pulse width is essentially determined

by the values of the external timing

components R

EXT

and C

EXT

. For

pulse widths, when C

EXT

<

10 000 pF,

see Fig.9.

When C

EXT

 >

10 000 pF, the typical

output pulse width is defined as:

t

W

= 0.45

×

R

EXT

×

C

EXT

(typ.),

where:

t

W

=  pulse width in ns;

R

EXT

=  external resistor in k

;

C

EXT

= external capacitor in pF.

Schmitt-trigger action in the nA and

nB inputs, makes the circuit highly

tolerant to slower input rise and fall

times.

The ‘123’ is identical to the ‘423’ but

can be triggered via the reset input.

QUICK REFERENCE DATA

GND = 0 V; T

amb

= 25

°

C; t

r

= t

f

= 6 ns

Notes

1. C

PD

 is used to determine the dynamic power dissipation (P

D

 in

µ

W):

P

D

= C

PD

×

V

CC

2

×

f

i

+

(C

L

×

V

CC

2

×

f

o

) + 0.75

×

C

EXT

×

V

CC

2

×

f

o

+

D

×

16

×

V

CC

 where:

f

i

= input frequency in MHz

f

o

= output frequency in MHz

D = duty factor in %

C

L

= output load capacitance in pF

V

CC

= supply voltage in V

C

EXT

= timing capacitance in pF

(C

L

×

V

CC

2

×

f

o

) sum of outputs

2. For HC the condition is V

I

= GND to V

CC

For HCT the condition is V

I

= GND to V

CC

1.5 V

SYMBOL

PARAMETER

CONDITIONS

TYPICAL

UNIT

HC

HCT

t

PHL

/ t

PLH

propagation delay

C

L

= 15 pF;

V

CC

= 5 V;

R

EXT

= 5 k

;

C

EXT

= 0 pF

nA, nB to nQ, nQ

26

26

ns

 nR

D

 to nQ, nQ

20

23

ns

C

I

input capacitance

3.5

3.5

pF

C

PD

power dissipation

capacitance per

monostable

notes 1 and 2

54

56

pF

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1998 Jul 08

3

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

ORDERING INFORMATION

PIN DESCRIPTION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

74HC123N;

74HCT123N

DIP16

plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

74HC123D;

74HCT123D

SO16

plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

74HC123DB;

74HCT123DB

SSOP16

plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

74HC123PW;

74HCT123PW

TSSOP16

plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

PIN NO.

SYMBOL

NAME AND FUNCTION

1, 9

1A, 2A

trigger inputs (negative-edge triggered)

2, 10

1B, 2B

trigger inputs (positive-edge triggered)

3, 11

1R

D

, 2R

D

direct reset LOW and trigger action at positive edge

4, 12

1Q, 2Q

outputs (active LOW)

7

2R

EXT

/C

EXT

external resistor/capacitor connection

8

GND

ground (0 V)

13, 5

1Q, 2Q

outputs (active HIGH)

14, 6

1C

EXT

, 2C

EXT

external capacitor connection

15

1R

EXT

/C

EXT

external resistor/capacitor connection

16

V

CC

positive supply voltage

Fig.1  Pin configuration.

Fig.2  Logic symbol.

Fig.3  IEC logic symbol.

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1998 Jul 08

4

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

Fig.4  Functional diagram.

FUNCTION TABLE

Note

1. If the monostable was triggered

before this condition was

established, the pulse will

continue as programmed.

INPUTS

OUTPUTS

nR

D

nA

nB

nQ

nQ

L

X

X

L

H

X

H

X

L

(1)

H

(1)

X

X

L

L

(1)

H

(1)

H

L

H

H

L

H

H

= HIGH voltage level

L

= LOW voltage level

X

= don’t care

= LOW-to-HIGH transition

= HIGH-to-LOW transition

= one HIGH level output pulse

= one LOW level output pulse

Fig.5  Logic diagram.

(1) For minimum noise generation,

it is recommended to ground pins 6 (2C

EXT

)

and 14 (1C

EXT

) externally to pin 8 (GND).

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1998 Jul 08

5

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

DC CHARACTERISTICS FOR 74HC

For the DC characteristics see

“74HC/HCT/HCU/HCMOS Logic Family Specifications”

.

Output capability: standard (except for nR

EXT

/C

EXT

)

I

CC

 category: MSI

Fig.6  Timing component connections.

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1998 Jul 08

6

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

AC CHARACTERISTICS FOR 74HC

GND = 0 V; t

r

= t

f

= 6 ns; C

L

= 50 pF

SYMBOL

PARAMETER

T

amb

(

°

C)

UNIT

TEST CONDITIONS

74HC

V

CC

(V)

WAVEFORMS/

NOTES

+25

40 to +85

40 to +125

min. typ. max. min.

max.

min.

max.

t

PLH

propagation delay

nR

D

, nA, nB to nQ

83

30

24

255

51

43

320

64

54

385

77

65

ns

2.0

4.5

6.0

C

EXT

= 0 pF;

R

EXT

= 5 k

t

PLH

propagation delay

nR

D

, nA, nB to nQ

83

30

24

255

51

43

320

64

54

385

77

65

ns

2.0

4.5

6.0

C

EXT

= 0 pF;

R

EXT

= 5 k

t

PHL

propagation delay

nR

D

 to nQ (reset)

66

24

19

215

43

37

270

54

46

325

65

55

ns

2.0

4.5

6.0

C

EXT

= 0 pF;

R

EXT

= 5 k

t

PLH

propagation delay

nR

D

 to nQ (reset)

66

24

19

215

43

37

270

54

46

325

65

55

ns

2.0

4.5

6.0

C

EXT

= 0 pF;

R

EXT

= 5 k

t

THL

 / t

TLH

output transition

time

19

7

6

75

15

13

95

19

16

110

22

19

ns

2.0

4.5

6.0

t

W

trigger pulse width

nA = LOW

100

20

17

8

3

2

125

25

21

150

30

26

ns

2.0

4.5

6.0

Fig.7

t

W

trigger pulse width

nB = HIGH

100

20

17

17

6

5

125

25

21

150

30

26

ns

2.0

4.5

6.0

Fig.7

t

W

reset pulse width

nR

D

= LOW

100

20

17

14

5

4

125

25

21

150

30

26

ns

2.0

4.5

6.0

Fig.8

t

W

output pulse width

nQ = HIGH

nQ = LOW

450

µ

s

5.0

C

EXT

= 100 nF;

R

EXT

= 10 k

;

Figs 7 and 8

t

W

output pulse width

nQ = HIGH

nQ = LOW

75

ns

5.0

C

EXT

= 0 pF;

R

EXT

= 5 k

;

note 1; Figs 7 and 8

t

rt

retrigger time

nA, nB

110

ns

5.0

C

EXT

= 0 pF;

R

EXT

= 5 k

;

note 2; Fig.7

R

EXT

external timing

resistor

10

2

1000

1000

k

2.0

5.0

Fig.9

C

EXT

external timing

capacitor

no limits

pF

5.0

Fig.9; note 3

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1998 Jul 08

7

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

DC CHARACTERISTICS FOR 74HCT

For the DC characteristics see

“74HC/HCT/HCU/HCMOS Logic Family Specifications”

.

Output capability: standard (except for nR

EXT

 / C

EXT

)

I

CC

 category: MSI

Note to HCT types

The value of additional quiescent supply current (

I

CC

) for a unit load of 1 is given in the family specifications.

To determine

I

CC

 per input, multiply this value by the unit load coefficient shown in the table below.

INPUT

UNIT LOAD COEFFICIENT

nA, nB

0.35

nR

D

0.50

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1998 Jul 08

8

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

AC CHARACTERISTICS FOR 74HCT

GND = 0 V; t

r

= t

f

= 6 ns; C

L

= 50 pF

SYMBOL

PARAMETER

T

amb

(

°

C)

UNIT

TEST CONDITIONS

74HCT

V

CC

(V)

WAVEFORMS/

NOTES

+25

40 to +85

40 to +125

min. typ. max. min. max.

min.

max.

t

PHL

propagation delay

nR

D

, nA, nB to nQ

30

51

64

77

ns

4.5

C

EXT

= 0 pF;

R

EXT

= 5 k

t

PLH

propagation delay

nR

D

, nA, nB to nQ

28

51

64

77

ns

4.5

C

EXT

= 0 pF;

R

EXT

= 5 k

t

PHL

propagation delay

nR

D

 to nQ (reset)

27

46

58

69

ns

4.5

C

EXT

= 0 pF;

R

EXT

= 5 k

t

PLH

propagation delay

nR

D

 to nQ (reset)

23

46

58

69

ns

4.5

C

EXT

= 0 pF;

R

EXT

= 5 k

t

THL

 / t

TLH

output transition time

7

15

19

22

ns

4.5

t

W

trigger pulse width

nA = LOW

20

3

25

30

ns

4.5

Fig.7

t

W

trigger pulse width

nB = HIGH

20

5

25

30

ns

4.5

Fig.7

t

W

reset pulse width

nR

D

= LOW

20

7

25

30

ns

4.5

Fig.8

t

W

output pulse width

nQ = HIGH

nQ = LOW

450

µ

s

5.0

C

EXT

= 100 nF;

R

EXT

= 10 k

;

Figs 7 and 8

t

W

output pulse width

nQ = HIGH

nQ = LOW

75

ns

5.0

C

EXT

= 0 pF;

R

EXT

= 5 k

;

note 1; Figs 7 and 8

t

rt

retrigger time

nA, nB

110

ns

5.0

C

EXT

= 0 pF;

R

EXT

= 5 k

;

note 2; Fig.7

R

EXT

external timing

resistor

2

1000

k

5.0

Fig.9

C

EXT

external timing

capacitor

no limits

pF

5.0

Fig.9; note 3

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1998 Jul 08

9

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

Notes to AC characteristics

1. For other R

EXT

 and C

EXT

 combinations see Fig.9.

If C

EXT

>

10 nF, the next formula is valid:

t

W

= K

×

R

EXT

×

C

EXT

(typ.)

where: t

W

= output pulse width in ns;

R

EXT

= external resistor in k

; C

EXT

= external capacitor in pF;

K

 = constant = 0.55 for V

CC

= 5.0 V and 0.48 for V

CC

= 2.0 V.

The inherent test jig and pin capacitance at pins 15 and 7 (nR

EXT

 / C

EXT

) is approximately 7 pF.

2. The time to retrigger the monostable multivibrator depends on the values of R

EXT

 and C

EXT

.

The output pulse width will only be extended when the time between the active-going edges of the trigger input pulses

meets the minimum retrigger time.

If C

EXT

>

10 pF, the next formula (at V

CC

= 5.0 V) for the set-up time of a retrigger pulse is valid:

t

rt

= 30 + 0.19

×

R

EXT

×

C

EXT

0.9

+ 13

×

R

EXT

1.05

 (typ.)

where:

t

rt

= retrigger time in ns;

C

EXT

= external capacitor in pF;

R

EXT

= external resistor in k

.

The inherent test jig and pin capacitance at pins 15 and 7 (nR

EXT

 / C

EXT

) is 7 pF.

3. When the device is powered-up, initiate the device via a reset pulse, when C

EXT

<

50 pF.

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1998 Jul 08

10

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

AC WAVEFORMS

Fig.7

Output pulse control using retrigger pulse;

nR

D

= HIGH.

Fig.8

Output pulse control using reset input in nR

D

;

nA = LOW.

Fig.9

Typical output pulse width as a function of the

external capacitor values at V

CC

= 5.0 V and

T

amb

= 25

°

C.

Fig.10 HCT typical “k” factor as a function of V

CC

;

C

X

= 10 nF; R

X

= 10 k

 to 100 k

.

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1998 Jul 08

11

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

APPLICATION INFORMATION

Power-up considerations

When the monostable is powered-up it may produce an

output pulse, with a pulse width defined by the values of R

X

and C

X

, this output pulse can be eliminated using the

circuit shown in Fig.11.

Power-down considerations

A large capacitor (C

X

) may cause problems when

powering-down the monostable due to the energy stored

in this capacitor. When a system containing this device is

powered-down or a rapid decrease of V

CC

 to zero occurs,

the monostable may substain damage, due to the

capacitor discharging through the input protection diodes.

To avoid this possibility, use a damping diode (D

X

)

preferably a germanium or Schottky type diode able to

withstand large current surges and connect as shown in

Fig.12

Fig.11  Power-up output pulse elimination circuit.

Fig.12  Power-down protection circuit.

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1998 Jul 08

12

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

PACKAGE OUTLINES

UNIT

A

max.

1

2

b

1

c

E

e

M

H

L

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

92-10-02

95-01-19

A  

min.

A  

max.

b

max.

w

M

E

e

1

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.254

2.54

7.62

0.30

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7

0.51

3.7

0.15

0.021

0.015

0.013

0.009

0.01

0.10

0.020

0.19

050G09

MO-001AE

M

H

c

(e  )

1

M

E

A

L

seating plane

A

1

w

M

b

1

e

D

A

2

Z

16

1

9

8

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 

(1)

(1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

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1998 Jul 08

13

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

X

w

M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v

M

A

(A  )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 

1.0

0.4

 SOT109-1

95-01-23

97-05-22

 076E07S

 MS-012AC

0.069

0.010

0.004

0.057

0.049

0.01

0.019

0.014

0.0100

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.244

0.228

0.028

0.020

0.028

0.012

0.01

0.25

0.01

0.004

0.039

0.016

0

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

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1998 Jul 08

14

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

UNIT

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

0.21

0.05

1.80

1.65

0.25

0.38

0.25

0.20

0.09

6.4

6.0

5.4

5.2

0.65

1.25

7.9

7.6

1.03

0.63

0.9

0.7

1.00

0.55

8

0

o

o

0.13

0.2

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 

 SOT338-1

94-01-14

95-02-04

(1)

w

M

b

p

D

H

E

E

Z

e

c

v

M

A

X

A

y

1

8

16

9

θ

A

A

1

A

2

L

p

Q

detail X

L

(A  )

3

 MO-150AC

pin 1 index

0

2.5

5 mm

scale

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

A

max.

2.0

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1998 Jul 08

15

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

UNIT

A

1

A

2

A

3

b

p

c

D

(1)

E

(2)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

 REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

 IEC

 JEDEC

 EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.40

0.06

8

0

o

o

0.13

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

 SOT403-1

 MO-153

94-07-12

95-04-04

w

M

b

p

D

Z

e

0.25

1

8

16

9

θ

A

A

1

A

2

L

p

Q

detail X

L

(A  )

3

H

E

E

c

v

M

A

X

A

y

0

2.5

5 mm

scale

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

A

max.

1.10

pin 1 index

background image

1998 Jul 08

16

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

DIP

S

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260

°

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300

°

C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400

°

C, contact may be up to 5 seconds.

SO, SSOP and TSSOP

R

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO, SSOP

and TSSOP packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method.

Typical reflow temperatures range from 215 to 250

°

C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45

°

C.

W

AVE SOLDERING

Wave soldering can be used for all SO packages. Wave

soldering is not recommended for SSOP and TSSOP

packages, because of the likelihood of solder bridging due

to closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

If wave soldering is used - and cannot be avoided for

SSOP and TSSOP packages - the following conditions

must be observed:

A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

The longitudinal axis of the package footprint must be

parallel to the solder flow and must incorporate solder

thieves at the downstream end.

Even with these conditions:

Only consider wave soldering SSOP packages that

have a body width of 4.4 mm, that is

SSOP16 (SOT369-1) or SSOP20 (SOT266-1).

Do not consider wave soldering TSSOP packages

with 48 leads or more, that is TSSOP48 (SOT362-1)

and TSSOP56 (SOT364-1).

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260

°

C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150

°

C within

6 seconds. Typical dwell time is 4 seconds at 250

°

C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

background image

1998 Jul 08

17

Philips Semiconductors

Product specification

Dual retriggerable monostable

multivibrator with reset

74HC/HCT123

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less

than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300

°

C. When using a

dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320

°

C.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.